The results indicate the stress of copper interconnects generates in the metallization and the thermal stress caused by thermal mismatch during the Damascene process is the main stress.

• 对测量结果的分析得出金属薄膜的淀积是造成铜互连线中应力的主要原因，热应力在铜互连线应力中占较大比例，热处理后铜互连线中应力减小。