The microstructure of TLP joint using 67Cu-33Mn-5Ni as the interlayer was denser than that of the TLP joint using 67Cu-33Mn as the interlayer.

• 结果表明,中间层67Cu-33Mn-5Ni获得的接头比中间层67Cu-33Mn的显微组织更致密,结合性更好。