The influence of accelerator,suppressor and leveler on copper deposits of pulse electroplating applied in copper interconnecting technique as well as their working principle were studied.

• 针对集成电路电镀铜技术,研究了三种有机添加剂(加速剂、抑制剂和平整剂)对铜互连线脉冲电镀的影响及其机制。