The high-temperature piezoresis-sensitive chip was packaged on the Pyrex glass ring with electrostatic bonding process, so the elastic sensitive element with reversed cup structure was obtained.

• 耐高温压阻力敏芯片通过静电键合工艺封接在硼硅玻璃环上，得到高频响倒杯结构的弹性敏感单元。