The growth rates of the Sn-3Ag-0.5Cu/Cu IMC were enhanced in the high magnetic field, and the growth activation energy is about 16kJ/mol (without HMF) and 51kJ/mol (with HMF). The HMF reduced the growth activation energy of the Sn-3Ag-0.5Cu/Cu joints.

• 与无磁场条件相比；强磁场条件下界面金属间化合物层的生长速率明显加快；且强磁场与无磁场条件下Sn-3Ag-0.；5Cu/Cu界面金属间化合物的生长激活能分别为:16kJ/mol和51kJ/mol；强磁场降低了Sn-3Ag-0