The fourth part of this work was to enhance the RIE resistance of the photoresist by substituting the cycloolefin structure for the acrylate structure.

• 第四部份延伸第三部份之脱水交联反应机制于环烯类负型树脂，并验证环烯类光阻剂具有较压克力光阻剂更优秀的抗蚀刻能力。