The enhanced adhesion of Cu films on Si substrates under MeV Cl ion beam irradiation was studied through analysis of Scanning Auger Microprobe (SAM) and Secondary Ion Mass Spectroscopy(SIMS).

• 本文通过用扫描俄歇微探针（SAM）和二次离子质谱（SIMS）分析了高能氯离子注 入Cu/Si系统，对Cu薄膜附着力增强效应进行了研究。