The EDX analysises for the IMC of Sn-3Ag-0.5Cu/Cu and Sn-0.7Cu/Ni solder joints indicate that different magnetic field directions have different effects on the atomic diffusion of different constitute elements.

 
  • 且正反向强磁场条件下Sn-3Ag-0.;5Cu/Cu焊点及Sn-0
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