Tested per JEDEC Standard JESD51-3. For additional information, refer to the TI Application Report; Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices, literature number SCZA005.

• 其它信息参见TI应用报告《标准线性和逻辑(SLL)封装和器件的热特征》，文献代码：SCZA005。