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- Poor wettability of lead-free solder brings about challenge to present electronic assembly technology.Nitrogen protection can improves wettability of lead-free solder and solder joint quality. 无铅钎料差的润湿性给传统电子组装工艺带来了巨大的挑战,氮气保护有利于改善无铅钎料的润湿性,提高焊点质量。
- Research of Effect of Cooling Rate on Lead- free Solder and Solder Joint Quality 冷却速率对无铅钎料和焊点质量影响
- The Technology of SMT Solder Joint Quality Automatic Testing and Intelligent Detecting SMT焊点质量自动检测与智能鉴别技术
- Solder Joint Quality 焊点质量
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面组装技术(SMT)形成的产品，其焊点质量直接影响到产品的可靠性和寿命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面组装技术(SMT)形成的产品,其焊点质量直接影响到产品的可靠性。
- solder joints quality 焊点质量
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- Solder end valves are limited by temperatures which affect the strength of the solder joint. 焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内。
- Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint. 皂化剂中所含成分，若不采用适当的抑制剂，将会侵蚀金属表面，造成焊点钝化。
- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研讨了影响SMT焊接点热疲劳性能的因素及研究方法。
- The results show that the residual moisture within underfill materials enhances the stress level in solder joint. 结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
- Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48. 焊料连接准备工作的重要步骤在本样本第48页中有图文并茂的描述。
- The solder will be dull looking and, if the gold content in the solder exceeds about 5%, the solder joint will be brittle. 焊点外观将变得暗淡,此外,如果焊料中的金成分超过约5%25时,焊点将会变脆。
- Welding current and time are the two most important determinants of joint quality in welding conditions. 焊接电流和焊接时间是对接头质量影响最大的焊接规范参数;
- New developments in flux chemistries for lead-free pastes do not require nitrogen to achieve good wetting and solder joint integrity. 无铅焊锡膏的焊剂化学的新发展可以做到不使用氮气也可得到良好的熔湿性和焊点完整性。
- Under temperature cycling (thermomechanical fatigue) conditions, this Pb-rich phase tends to coarsen and eventually leads to solder joint cracking. 在温度循环条件（即热机械疲劳条件）下，富铅相会变粗并最终导致焊点破裂。
- Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly. 焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
