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- SIMOX wafer bonding technology 注氧键合技术
- An equipment for vacuum wafer bonding was developed based on the wafer bonding technology. 摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。
- Wafer Bonding Technology and Its Applications in Vertical Cavity Devices 晶片键合技术及其在垂直腔型器件研制中的应用
- Low Temperature Wafer Bonding Technology and Its Applications to Telecommunications Optoelcetronic Devices 低温晶片键合技术及在通信光电子器件中的应用
- Bond strength is an important parameter for wafer bond. 键合强度是关系到键合好坏的一个重要参数。
- Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass. 半导体硅与玻璃的静电键合技术是微电子机械系统(MEMS)的关键技术，而作为关键材料之一的静电键合玻璃有着广阔的工业应用前景。
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
- Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field. 摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
- Four fundamental manufacturing technologies namely bulk micromachining,surface micromachining,moulding and wafer bonding are introduced for Micro Electro Mechanical System(MEMS). 介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
- Over coming lattice and orientation mismatch, direct wafer bonding allows fabricating of structures and devices which can 抰 get through hetero-epitaxial growth. 利用键合技术可以集成晶格或晶向失配的材料，制造传统外延生长技术不能制造的结构和器件。
- Silicon wafer direct bonding technology 硅片直接键合技术
- The applications of cryogenic adhesive bonding technology in SQUID non-magnetic Dewar and other fields are introduced. 介绍了低温粘接技术在 SQU ID无磁杜瓦及其它领域中的应用。
- Hence,the new punching bonding technology from TOX company of Germany and its practical application are presented in this paper. 本文介绍了德国TOX公司的一种全新的冲压连接技术及其在实际生产中的应用。
- Some applications of medical adhesives and their bonding technology in the medicine domain were briefly introduced in this article. 简要介绍了医用胶粘剂及其粘接技术在医学领域中的一些应用。
- A preliminary attempt at the application of MATLAB in the study of bonding technology of structural glulam made of Larch is made. 摘要对MATLAB在落叶松结构用集成材胶合工艺技术研究中的应用进行了初步尝试。
- Measurements of the Bond Strength for Wafer Bonding 硅片键合强度测试方法的进展
- Timing Test for Picking Up of Wafer Bonding Machine 硅片焊接机拾起硅片时序测定方法
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- The Advances in Wafer Bonding and MEMS 晶圆键合技术与微电子机械系统新进展
