One is the geometric parameters of a flip-chip package are random variables.The other is parameters of the Coffin-Manson equation are also random variables.

• 研究方法为在适当随机考量下，利用有限元素软体，模拟覆晶构装体受温度循环负载，得到等效非弹性应变范围，再经由寿命预估公式求得构装体的随机疲劳寿命及其量化可靠度。