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- Mouray solder 锌基铅铜焊料
- Suit for reflow and wave flow solder. 适应再流焊与波峰焊。
- SMOBC: Solder mask over bare copper. 一种阻焊层覆盖裸铜的工艺。
- Type of high density solder mask. 一种高密度焊料掩膜。
- Is there a standard lead-free solder alloy? 是否存在一种标准无铅焊料合金?
- Heat stability is more evident with solder paste. 焊锡膏的热稳定性就更为明显。
- Stir solder paste in container before use. 使用时搅拌容器内的焊膏。
- Automatically clean the sediment before solder. 自动刮除氧化的锡，达到清理锡液面的功能。
- All electronics assemblies using lead in solder. 使用含铅焊料的所有电子配件。
- Do not solder directly to cells or batteries. 不要直接对电池进行焊接。
- Solder end valves also available. 也可以提供焊接连接端口的阀门。
- Solder side is chosen to measure. 4量测以吃锡面为选择点。
- An ideal connection that puts any solder to shame. 这种理想的连结方式，让其它各类接合方式瞠乎其后。
- Less residue,shinny and clean solder spot. 残留物少;焊点光泽;干净.
- Surface to solder are gold and clean. 待焊接的表面是清洁的金面。
- Thank you for using SMIC Solder Recovery System! 感谢您购买斯迈克锡渣还原机产品！
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- Very high activity rosin flux used for difficult to solder metals. 用以对难以焊接金属进行焊接的极高活性松香助焊剂。
- Silver and copper tend to not dross out of the solder pot. 银和铜不易在焊料槽中生成残渣。
- Remove the solder so that there is no contact between the diodes. 除去焊锡,使得两个二极管不接触。
