Most recently, they have introduced their MicroTouch feature that reduces touchdown damage that can occur when testing fragile devices or when pads are located over active circuit geometry.

 
  • 回顾半导体产业的发展,晶圆从6英寸进化到8英寸,一直到现在的12英寸晶圆,伊智的技术发展和自动化水平也能亦步步趋,满足更加精确、速的系统。
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