Moreover, underfill is usually thermosetting polymer and the process of hardening is time-consuming.If the die is found it cannot work after baking of underfill, the die cannot be replaced.

• 然因底胶通常为热固性的高分子聚合物，不仅固化过程过于耗时，同时经过烘烤固化后若发现晶片功能出现瑕疵，将无法进行重工。