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- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- Analyse the failure modes and mechanism of the mixed solder joint,and introduce the effect factors of reliability ulteriorly. 对混合焊点的失效形式和混合焊点的失效机理进行了分析,并进一步介绍了影响这类焊点可靠性的因素。
- The analysis results show that process is the most important effect factor for the prophase reliability of mixed solder joint, and environment is the most important effect factor for the anaphase reliability of mixed solder joint. 分析结果显示，工艺对混合焊点的前期可靠性影响最大，环境对混合焊点的后期可靠性影响最大。
- Reliability Analysis of Backwards Compatible Mixed Solder Joint 向后兼容混合焊点的可靠性分析
- Reliability study of BGA mixed solder joint under thermal cycle BGA混合焊点热循环负载下的可靠性研究
- Mixed solder joint 混合焊点
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- mixed solder joints 混合焊点
- Solder end valves are limited by temperatures which affect the strength of the solder joint. 焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内。
- Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint. 皂化剂中所含成分，若不采用适当的抑制剂，将会侵蚀金属表面，造成焊点钝化。
- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研讨了影响SMT焊接点热疲劳性能的因素及研究方法。
- The results show that the residual moisture within underfill materials enhances the stress level in solder joint. 结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
- Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48. 焊料连接准备工作的重要步骤在本样本第48页中有图文并茂的描述。
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面组装技术(SMT)形成的产品，其焊点质量直接影响到产品的可靠性和寿命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面组装技术(SMT)形成的产品,其焊点质量直接影响到产品的可靠性。
- The solder will be dull looking and, if the gold content in the solder exceeds about 5%, the solder joint will be brittle. 焊点外观将变得暗淡,此外,如果焊料中的金成分超过约5%25时,焊点将会变脆。
- New developments in flux chemistries for lead-free pastes do not require nitrogen to achieve good wetting and solder joint integrity. 无铅焊锡膏的焊剂化学的新发展可以做到不使用氮气也可得到良好的熔湿性和焊点完整性。
- Under temperature cycling (thermomechanical fatigue) conditions, this Pb-rich phase tends to coarsen and eventually leads to solder joint cracking. 在温度循环条件（即热机械疲劳条件）下，富铅相会变粗并最终导致焊点破裂。
- Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly. 焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
