Microelectronics need superthin film of heat resistant polymers, particularly PI superthin film.Superthin film may be made by L-B method.

 
  • 近年来随着微电子工业的发展;要求发展超薄耐热聚合物薄膜;尤其是聚酰亚胺(PI)超薄薄膜.
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