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- Lead - free solder paste 无铅焊膏
- TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable. TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。
- Research of Activation Temperature of Rosin- Based Flux for Lead- Free Solder Paste 无铅焊膏用松香型助焊剂活化点的研究
- Kester EnviroMark 808 is a lead free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. 凯斯特EnviroMark 808是一种无铅有机酸水溶性焊锡膏,具有最高等级的一致性和性能。
- Heat stability is more evident with solder paste. 焊锡膏的热稳定性就更为明显。
- Stir solder paste in container before use. 使用时搅拌容器内的焊膏。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- The use of nitrogen will depend on the solder paste flux chemistry. 是否使用氮气取决于焊锡膏焊剂的化学特性。
- Is the sequence of Solder Paste height measurements defined? 锡膏厚度的测量顺序是否指定?
- Is the average and range of Solder Paste height measurements SPC controlled? 锡膏厚度测量的平均值和间距SPC是否受控?
- What are the main qualification tests for using lead-free solder paste? 使用无铅焊锡膏的主要评选测试有哪些?
- RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste. RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。
- The operator should use the solder paste quickly after it has been taken out. 取出的锡膏要尽快实施印刷使用。
- Forced convection cooling system to easily reach the requirements of strict lead free soldering processes. 强制冷却系统实现急冷达到无铅焊接工艺的冷却降温要求。
- Soldering materials are our major products, especially in Lead Free Soldering Materials. 焊锡物料是我们的主要产品，特别是无铅焊锡物料。
- Solder paste residues, which remain in fine-pitch apertures after manual cleaning, cause inconsistent print images and thus can lead to bridges and solder balling between solder joints. 手工清洗后，残留在网板细间距开口中的焊锡膏会造成印刷图形不连续，从而发生桥接和焊点之间的焊球。
- Are LCD's and UCLA's defined for the average and range of Solder Paste measurements? 对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?
- The Main products to be exhibited: Lead free soldering machine, nitrogen lead free reflux soldering machine, inserter wire, SMD relative equipment, anti-static series of products. 无铅波峰焊锡机、氮气无铅回流焊锡机、插件线、SMD周边设备、防静电系列产品。
- Is the upper and lower specification limits for individual Solder Paste height measurements also defined? 单点锡膏厚度测量是否定义了其控制上限和下限?
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
