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- Application and Research Progress of Laser Bonding Technology in Packaging 激光键合技术在封装中的应用及研究进展
- Laser bonding technology 激光键合技术
- An equipment for vacuum wafer bonding was developed based on the wafer bonding technology. 摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。
- The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method. 摘要在硅/玻璃激光键合中，温度场的分布是影响晶片能否键合的关键因素。
- The applications of cryogenic adhesive bonding technology in SQUID non-magnetic Dewar and other fields are introduced. 介绍了低温粘接技术在 SQU ID无磁杜瓦及其它领域中的应用。
- Then the key process parameters of laser bonding, including laser power, scanning velocity, and initial temperature, are obtained with the help of scanning experiments. 运用该模型计算了不同的工艺参数条件下硅/玻璃的温度场分布，并由此得出键合线宽。
- Hence,the new punching bonding technology from TOX company of Germany and its practical application are presented in this paper. 本文介绍了德国TOX公司的一种全新的冲压连接技术及其在实际生产中的应用。
- Some applications of medical adhesives and their bonding technology in the medicine domain were briefly introduced in this article. 简要介绍了医用胶粘剂及其粘接技术在医学领域中的一些应用。
- A preliminary attempt at the application of MATLAB in the study of bonding technology of structural glulam made of Larch is made. 摘要对MATLAB在落叶松结构用集成材胶合工艺技术研究中的应用进行了初步尝试。
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass. 半导体硅与玻璃的静电键合技术是微电子机械系统(MEMS)的关键技术，而作为关键材料之一的静电键合玻璃有着广阔的工业应用前景。
- It is the first company in China to have developed the chemical adhesive bonding technology instead of traditional sewing technology for filter fabric connection, improving the industrialization, performances and stability of products. 采用纯新聚丙烯原材料制作塑料芯板替代废旧低质的塑料芯板，提高了排水板的力学性能和稳定性及耐久性。
- This paper focuses on the research of bonding technology of Chinese Larch Glulam (glued-laminated timber) with Phenol resorcinol formaldehyde(PRF) and Aqueous polymer Isocyanate(API)adhesives. 本论文对常温固化型胶粘剂间苯二酚PRF和高分子异氰酸酯API落叶松集成材的胶合工艺技术进行了研究。
- Ceramic - metal composite components have a wide application prospect, and the bonding technology of ceramics to metals is a key to the practical application of ceramics to engineering. 陶瓷与金属组成的复合构件具有广阔的应用前景,而陶瓷与金属的连接技术是陶瓷工程应用的关键。
- For the cxample of a 19-meter-span framed girder, this paper expounds the application of prestress with bond technology which is used during the project practice of large-span girder through the discussion on construction and economy. 本文通过某工程 19m跨度框架梁的实例 ,从施工及经济性等方面阐述了有粘结预应力技术在大跨度梁的工程实践中的应用。
- In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM. 另外，由于芯片倒装焊接的三种关键支撑技术的发展在很大程度上影响着MCM中倒装焊接技术的普及应用，本文还对三种支撑技术进行了研究。
- Finite element analysis in tin-ball laser bonding on hard disk sliders 硬盘磁头激光锡球焊接有限元分析
- Silicon wafer direct bonding technology 硅片直接键合技术
- Surface Mounting and Chip Bonding Technology 表面组装与芯片键合混合工艺浅探
