It is widely used for encapsulation of surface wave filter , resonator , module circuit , photoelectric component ,sensor and sensing device ,etc.Components.

 
  • 广泛应用于声表面滤波器、谐振器、模块电路、光电器件、传器、敏感件等元器件生产的封装。
今日热词
目录 附录 查词历史