It is noted that there is a thin fluid film between the loaded asperities and the wafer being polished in CMP process, thereby a flow system with nano scale film is formed in.

• 在简述化学机械抛光技术的基础上,提出化学机械抛光过程中,受载的粗糙峰和被抛光的晶片表面之间存在一纳米量级的薄流体膜,形成了纳米级薄膜流动系统。