In addition, microvoids were found to nucleate in grain boundaries and/or matrix/intermetallic interfaces (MIIs) for the two lead-free solders at different temperatures.

• 此外，在两款无铅焊锡中可发现微小孔洞会成核在晶界面与（或）介金属界面，而此两者的差异主要受到实验温度的不同所影响。