In MEMS fabrications for devices and systems, inductively coupled plasma (ICP) etching is a popular technology owing to its convenient operation, excellent anisotropy, high etch rate and low cost.

• 在MEMS器件及系统的制造中,电感耦合等离子体(ICP)对硅片的刻蚀工艺由于具备操作简单、各向异性性能好、刻蚀速率快、成本低等特点,是目前实现高深宽比结构制造的主流工艺。