If test points are more than 6 nods:(1) Big BGA must be tested (2) QFP can be omitted to test. You can inspect the pad appearance instead of test.

• 若量测点超过六点时：(1)大颗BGA一定要量测(2)QFP可省略不量，改以目检焊点的外观来调整温度曲线。