For conventional hot embossing, the substrate and the stamp are brought into contact and are compressed directly by the hot platen.

• 摘要:传统微奈米压印方法藉由压板机构来对基材进行加热及加压成形，容易导致压力施加不均匀、压印面积受限制以及微结构复制精度不良等问题；