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- Flip Chip Pin Grid Array 反转芯片针脚栅格阵列
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
- PPGA:(Plastic Pin Grid Array Package) 塑料插针矩阵封装电脑常用缩略词(二十)点对点协议
- Metallized Ceramic - Pin Grid Array HPI 金属化陶瓷-接脚栅格阵列
- CPGA: Ceramic Pin Grid Array Package 陶瓷针栅阵列封装一点
- When testing multi-diode devices, such as pin grid arrays or DIP packages, switching is required to connect a single source-measure instrument to each individual diode. 在测试多二极管装置时，例如针栅阵列矩阵或DIP封装器件，需要开关来将源测量仪器连接到每个二极管。
- the PGA132 package-ceramic pin grid array is employed. 采用陶瓷针栅阵列PGA132封装。
- Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
- Adapter-Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment, Blank Detail Specification for 电子设备用针状栅极阵列插孔的适配器载体方形平板组件的详细规范
- Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment, Detail Specification for 电子设备用针状栅极阵列非机械推动挠性载体插孔的详细规范
- PGA Pin Grid Array Package 针栅阵列封装
- PPGA Plastic Pin Grid Array 塑胶针状矩阵封装
- Power Plastic Pin Grid Array 功率塑料插脚栅格阵列
- CPGA Ceramic Pin Grid Array 陶瓷针栅阵列矩阵
- PPGA: Plastic Pin Grid array 塑胶针状矩阵封装
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
- CPGA: Ceramic Pin Grid array 陶瓷针型栅格阵列
- The chip pin are connected with the control panel of the electric control part to make the system can be reassemble and expandable. 并遵循开放性的原则,设计将实验电路板上的相应引脚,引出至电气控制柜的控制面板,以实现实验系统的可重组性和可扩展性。
- The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
