Find failure root cause by performing component eletrical and physical failure analysis, such like curve tracing, SAM, decapsulation, cross section, SEM etc.

• 通过对半导体器件进行电性及物理失效分析,例如电性曲线分析，超声波扫描，开盖，断面，电子扫描显微等，找出失效的真正原因。