您要查找的是不是:
- The influences of heat treatment on structure micro hardness, static corrosion resistance in normal temperature and hot solution corrosion resistance of electroless Ni P and Ni Co P alloy coatings were studied. 研究了热处理对化学沉积Ni-P、Ni-Co-P合金镀层的组织结构、显微硬度、常温静态腐蚀性能和热溶液腐蚀性能的影响。
- This paper deals with the adhesive state of amorphous Ni P alloy plating using impact fracture test method and also measuring the adhesive strength of the plating quantitatively. 用金相冲击断口法研究了化学沉积非晶态镍磷合金层与基体的结合状况,并用扭转法定量测量了化学沉积合金层的附着强度参数。
- A Study on Fe Ni P Alloy Plating 铁-镍-磷合金电镀的研究
- Keywords electroplating;Ni P alloy;sodium hypophosphite; 电镀;镍磷合金;次亚磷酸钠;
- It is proved that electroless composite plating Ni P Si 3N 4 on piston ring is a new technology,which is worth application and dissemination. 结果表明:活塞环化学复合镀Ni-P-Si3N4是一种值得推广应用的新型工艺方法。
- Ni P alloy Ni-P合金
- The performances of Ni three-part alloy layer of elec-troless Ni-P and Ni-B plating and alloy layer of compound electroless Ni plating were described and their application in petrochemical industry was introduced. 对化学镀Ni-P、Ni-B、镍三元合金镀层及其复合化学镍合金镀层的特性进行了论述;对化学镀镍合金在石化工业中的应用进行了介绍.
- Under the same heating rate, the crystallization temperature of Ni P UFD composite coating is lower than that of Ni P coating, while the peak temperature of the two electroless coating are well matched. 在相同的加热速率下 ,Ni P UFD复合镀层晶化的起始温度均低于Ni P镀层 ,但峰值温度与Ni P镀层相当 ;
- after aging treatment to crystallize , amorphous Ni P alloys possess lower corrosion resistance and greater hardening properties. 非晶态镍磷合金经过时效处理晶化后且组织结构发生变化,耐腐蚀性能下降,硬化性能则提高。
- On the base of the technology of electroless Ni plating on PET fabric,the electromagnetic shielding dacron fabric of different increasing weight rate was developed. 基于织物化学镀技术,开发出不同增重率的化学镀镍电磁屏蔽涤纶织物。
- While the amorphous Ni P alloys is aged at higher temperature than 613 K, they crystallize to precipitate Ni 3P, so that the hardness and wear resistance of the coatings incerase and are superior to the crystal alloy; 经过大于613K的时效处理,非晶态镍磷合金晶化且有Ni3P生成,沉积层的硬度和耐磨性得以提高并超过晶态合金;
- The application and prospect of electroless Ni plating in the field of microelectronic device and computer storage are described. 重点阐述了化学镀镍技术在微电子领域的应用,包括UBM制作、印制电路板表面终饰工艺和LCR元件制造,以及在计算机存储领域的应用。
- Regeneration of electroless Ni bath by electroosmosis was tentatively investigated through static electroomosis experiment. 通过静态电渗析实验,初步研究了电渗析法对化学镀镍液的再生。
- Process of hard Cr plating on electroless Ni coatings was investigated. Results showed heat treatment and cathodic activation before plating are key technical points. 研究了化学镀镍层上镀硬铬工艺。试验结果表明镀前热处理和阴极活化是其技术关键。
- The electroless Ni plating on Fe-based powder metallurgy articles was continuously carried out with pretreatments of pore sealing by immersing in zinc stearate in vacuum and ultrasonic cleaning. 采用真空硬脂酸锌浸渍封孔及超声波清洗前处理,对铁基粉末冶金件连续化学镀镍。
- Ageing of electroless Ni solution is studied showing effects of consumption of salt,reductant and other components on deposition rate. Also shown is effect of componentsaddition on bath life. 研究了化学镀镍液中主盐、还原剂及各组分的消耗量对沉积速度的影响,分析补加镀液的消耗成分以延长化学镀液的使用寿命。
- Study on Process and Property of Plating of Electroless Ni B Re Alloy 化学镀镍硼稀土合金镀层工艺与性能的研究
- Study of the Accelerating Agent for Electroless Ni 化学镀镍加速剂的研究
- Study of RE on effect of electroless Ni -P plating 稀土元素在化学镀Ni-P中作用的研究
- Cost and Price for Electroless Ni plating 化学镀镍的成本与价格