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- EMC at Component and PCB Leve 器件和线路板级电磁兼容
- Applying on aluminum board and PCB for insulation. 粘贴于铝板、PC板等上作绝缘使用。
- The similarity thresholds can be set at the component and join levels. 相似性阈值可以在组件级和联接级设置。
- We offer reference design (include schematics and PCB files, etc. 我们提供参考设计(包括原理图和PCB文件等)
- R3 resistance is the point of transfer between the barrel and PCB. R3电阻是套客体与PCB之间的传输点。
- Abstract: Surface Mount Technology is extensively applied in the assembly of electronic components and PCBs,PCB design is the key of Surface Mount Technology and guarantee of SMT quality. 摘要： 表面贴装技术在电子产品组装生产过程中正得到广泛应用，而印制板的合理和制造是SMT技术中的关键，也是SMT工艺质量的保证。
- Rebuild the component and register it. 重新生成该组件并注册它。
- Your metering needs are met with best-in-class performance, reliability, and EMC at an attractive system cost. 它具有同类产品中最优的性能、可靠性和EMC特性,而系统成本仍然极具吸引力。
- List each component and its state in the following table. 在下表中列出每一组件及其状态。
- High output level up to 19 dBm for component and overdrive testing. 高输出水平高达19 dBm的元件和过测试。
- At present, the system has been finished designing and PCB producing and is being debugged now. 目前，系统已经完成了设计和制板的过程，正在的紧张的调试中。
- We explained the design of optical converters in terms of component selection and PCB design. 从元器件选择、印刷电路板设计两方面阐述了光纤收发器的设计。
- How to add a scroll bar component and have it work at in design mode? 如何加入一个滚动条并使它在设计模式中工作?
- The similarity thresholds can be set at the component and the column levels. 相似性阈值可以在组件级和列级设置。
- For those large area component, such as LCD and PCB process, manufacturers use AOI (automatic optical inspection) equipments to ensure high quality of products. 在大面积元件制造过程中，例如：LCD或PCB制造厂，皆使用自动光学检查设备(AOI)来确保生产的产品品质。
- Ascertain the component and part mass guarantee agreement with new supplier. 与新开发的供应商确定零部件质量保证协议；
- Hardware part concludes the circuit diagram designing and PCB plate making. 系统硬件部分完成智能称重系统的电路原理图的设计和pcb硬制板的制作。
- The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays. 减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
- The component and acidolysis condition of soybean hulls were primarily studied. 对大豆皮的成分、酸水解条件进行了初步研究。
- Information regarding SMPS components and component suppliers. 与SMPS元件相关的资讯以及元件的提供。
