EDX, XRD, TEM, XPS and a microhardness tester were employed to characterize the microstructure and mechanical properties, as well as to investigate the influence of substrate temperature on these films.
英
美
- 采用电子能谱仪 (EDS)、X-射线衍射 (XRD)、透射电子显微镜 (TEM)、X-射线光电子能谱 (XPS)和显微硬度仪分析 Ti- Si- N系薄膜的微观结构和力学性能 ；以及基片温度对薄膜微结构和硬度的影响 .
