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- CBGA Ceramic Ball Grid Array 陶瓷焊球阵列
- Ceramic Ball Grid Array 陶球栅阵列
- ceramic ball grid array (CBGA) 陶瓷球栅阵列封装
- Desirable for high-performance Ball Grid Array (BGA) package. 高性能球形焊点阵列封装需要倒装焊。
- In this example, the area of the ball grid array (BGA) deposit appears normal but actually contains more than twice the expected volume and height. 在这个例子里，球栅阵列(BGA)焊膏沉积面积正常，但实际焊膏量大于期望量和期望高度的2倍。
- Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard. 按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
- This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. 中文摘要本文针对阵列锡球封装产品基板和胶饼间所产生的分层作研究。
- The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. 摘要球格阵列封装厂具有机台整备时间长、订单动态来到以及产品会再回流等三大特性。
- Start to work at FCI since 1998 as Ball grid array (BGA) connectors products marketing manger that was mainly targeted for CPU socket project in Note Book PC application during 1998 to 2000. 1998年加入FCI，1998年至2000年担任球栅阵列（BGA）连接器产品（该产品主要面向笔记本电脑应用中的CPU插槽）市场经理之职。
- Ball Grid Array Micro Pull Strength 球形栅格阵列微拉力测量
- Low-profile Fine pitch Ball Grid Array 小外型细间距球栅阵列
- The Ball Grid Array and Cleaning 球栅阵列器件及其清洗
- Enhanced plastic ball grid array 增强型塑料球栅阵列
- Ultra thin Fine pitch Ball Grid Array 超薄细节距球栅阵列
- PBGA (plastic ball grid array) assembly PBGA组件
- top bottom ball grid array (TB-BGA) 上下球栅阵列封装技术
- Thermal Stress Simulation for Plastic Ball Grid Array Package 塑料球栅阵列封装的热应力模拟
- Welding reliability of plastic ball grid array component 塑料封装球栅阵列器件焊点的可靠性
- Reliability test and analysis of 1.27 mm pitch plastic ball grid array soldered joint under thermal shock 热冲击条件下1.;27 mm引脚间距塑封球栅阵列器件焊点可靠性测试与分析
