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- CMOS chip encapsulation 芯片封装
- Quick diathermancy avoid damage to CMOS chip and solder. 精确的设计和制造工艺避免磨擦对焊盘可能造成的损坏;
- The powerof instrument is reduced greatly because of the CMOS chip being used. 另外仪器采用的所有芯片都是CMOS类型的,这样使得仪器的功耗大幅度降低。
- Through the DDS CMOS chip AD9851,the system produces a 64 points sampling signal. 通过DDS芯片AD9851来产生相对于输入信号64倍频的高精度采样信号。
- Adopt the advanced CPU CMOS chip and imported power switch All the functions can be controlled with buttons. 电脑控制器是国内首创的专利产品,选用先进的cpu芯片,进口开关电源供电。所有功能均采用安键操作,数码显示。
- So what are these CMOS chips, exactly? 那么这些CMOS芯片究竟是什么呢?
- The central unit of the whole system is 8051, multi-periphery interact CMOS chip are used as supplementary. 整个系统以8051为中央控制单元,辅以多种外围接口芯片,简单、方便的实现了速度调节功能、变频、调相选择功能。
- On the desigan of hardware of the system we choose the CMOS chip C8051F005 as the most controller CMOS chip. 在硬件设计上我们选用了CYGNAL 公司C8051F005 作为系统的主控芯片;
- On the hardware design of the system, the CMOS chip C8051F005 is chosen as the main control chip. 在硬件设计上选用了CYGNAL公司C8051F005作为系统的主控芯片;
- In the first chapter, basic information of DSP CMOS chip is given and so the application method using C language. 在第一章中介绍了DSP芯片的基本情况以及TMS320C3X的C语言开发方法。
- This system is developed with DSP CMOS chip (TMS320LF2407) and can meet a demand of real-time instances. 该系统采用DSP芯片TMS320LF2407,满足了实时性要求。
- In the practical application of the PCB CMOS chip, some intractable problems and its answers are given. 该PCB芯片板的实际应用中,涉及到的一些问题,以及这些问题的解决办法也作了介绍。
- The CMOS chip AT89C2051 is used in this system because there is only a small quantity of program to be stored. 由于程序存储量较少,现场的CPU选用ATMEL公司的低档型芯片AT89C2051;
- In this paper,the module of ADC in S3C2410 CMOS chip and the model about Windows CE. NET drivers are expounded. 详细介绍了S3C2410芯片ADC模块以及Windows CE.
- Design-For-Testability,DFT has become a very important part of the CMOS chip and system design. 可测试性设计(Design-For-Testability;DFT)已经成为芯片或系统设计中不可或缺的重要组成部分.
- By analyzing the status chart, the special interface CMOS chip GPIB is designed and realized by use of CPLD technology. 从它们的状态图出发,运用CPLD技术,设计了GPIB专用接口芯片。
- The section of LED chips encapsulation is the low value of LED industry, the LED chips encapsulation of high tech is handled in Taiwan and low tech is handle in Mainland. 封装属于低端环节,高端封装主要集中于台湾地区,低端封装则主要在大陆地区完成。
- The Synthesis tool and CMOS chip of Xilinx Company are applied to design the hardware. 硬件的设计是采用Xilinx公司的综合工具与芯片实现的。
- IBMs chip set customers will begin delivering CMOS chip sets to mobile phone manufacturers in 2008. IBM的芯片组客户将从2008开始向手机制造商提供CMOS芯片组。
- Designed a CMOS chip for the communications subsystem of the 6095 Graphics Terminal. 为6095图形终端的通讯子系统设计了一个CMOS芯片。
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