By analyzing the flip chip structure of high power InGaN blue +YAG fluorescence powders white light emitting diode (LED), it shows that it can improve the luminous and heat dissipation efficacy.

• 通过对高功率InGaN(蓝)LED倒装芯片结构+YAG荧光粉构成白光LED的分析,可以得出这种结构能提高发光效率和散热效果的结论。