Both devices are offered in two package styles: LH, a SOT-23W miniature low-profile package for surface-mount applications, and UA, a three-lead ultramini Single Inline Package (SIP) for through-hole mounting.

• 这两种器件均以两种封装类型提供:LH,供表面安装应用使用的SOT-23W微型低厚度封装;以及UA,供过孔安装使用的三引脚超小型单列直插式封装(SIP)。