Based on the current packaging practice and aimed for the dispensing process performance improving, it is the purpose of this thesis to realize the accurate fluid manipulation in AICE process by using a modeling and control approach.

• 本论文从封装过程的实践出发,以提高点胶过程性能为目标,从建模和控制的角度来研究半导体封装中的精确点胶问题。