Applications - Production, rework, and repair of through-hole and SMT boards. Contact removal of ICs and QFPs using specialty SMT tips. Lead-solder applications. Heavy ground planes and multi-layer boards.

• 生产、再加工和通孔与超小型电子管板的修理。专门用于超小型电子管焊端的ICs与QFPs的触点去除。铅-焊接应用。大块板与多层板。