And it is concluded that the electroplating technology will have a well prospect in the field of CCM surface treatment,besides,co-developing with other surface treatment and...

 
  • 认为未来的连铸结晶器表面处理领域,电镀技术将同其他表面技术共同并存、优势互补,电镀技术仍将具有很好的开发应用前景。
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