Abstract : The Organic Polymer Pastes (OPP) in chip resistance were researched with selecting and modifying organic resin, curing agent, solvent, and filler.

• 摘要: 通过选择与优化有机树脂、固化剂、溶剂、填料等，开发了片式电阻用的系列有机聚合物电子浆料。