A true global planarization can be achieved only by CMP technology right now,and it is used more and more widely in semi-conductor field.

• 化学机械抛光(CMP)技术作为目前唯一的可以提供在整个圆硅晶片上全面平坦化的工艺技术,已被越来越广泛地应用到了半导体领域。