A three dimensional(3D) LTCC microwave transmission structure was studied in this paper,and stacked vias were applied in the structure to realize vertical microwave interconnecting.

 
  • 本文研究采用了一种三维LTCC微波传输结构 ;并采用叠层通孔实现垂直微波互连 .
今日热词
目录 附录 查词历史