集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅;

集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅;的英文翻译

基本释义

• Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.