重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。

重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。的英文翻译

基本释义

• The forward compatibility, backward compatibility, tin whisker, voids, micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.